Product Center

NingboThick-film circuit

A thick‑film hybrid integrated circuit is a miniature electronic functional component that uses a ceramic substrate as its base. It employs various conductor pastes—such as palladium–silver, platinum–silver, and gold conductive pastes—as well as resistor paste for resistors—and applies thick‑film processes—including screen printing, 850°C high‑temperature sintering, and laser trimming of resistors—to fabricate passive networks on a single substrate. Discrete semiconductor device chips, monolithic integrated circuits, or microcomponents are then mounted on this substrate, followed by external packaging to form the complete hybrid integrated circuit.

Category:

NingboProduct Center

NingboProduct Customization

Phone: 400-888-8888

Request for quotation

Product Description

A thick-film hybrid integrated circuit is a miniature electronic functional component that uses a ceramic substrate as its base. It employs various conductor pastes—such as palladium–silver, platinum–silver, and gold—as well as resistor pastes, and utilizes thick-film processes—including screen printing, 850°C high-temperature sintering, and laser trimming of resistors—to fabricate passive networks on a single substrate. Discrete semiconductor device chips, monolithic integrated circuits, or micro‑components are then mounted on this substrate, followed by external packaging to form the complete hybrid integrated circuit.

Product Features:

High reliability, high stability, high integration, and low cost

Technical Process:

Substrate material	96 porcelain, 99 porcelain, aluminum nitride, printed circuit boards, etc.
Conductive paste	Palladium-silver, platinum-silver, gold, etc.
Resistor paste	DuPont 17 series, Heraeus R89 series, Xi’an Hongxing R-8200 series resistor pastes, and others.
Assembly	SMT, gold wire/aluminum wire bonding, soldering, conductive adhesive bonding, eutectic bonding, and others
Encapsulation	Epoxy coating, parallel seal welding

Thick-Film Circuit Material Systems and Conductor Connection Characteristics:

Membrane layer		Gold wire bonding	Aluminum wire bonding	Eutectic bonding	Soldering	Epoxy bonding
Conductive layer	Gold	Y	N	Y	N	Y
	Pd /Ag	N	Y	N	Y	Y
	Pt/Ag	N	Y	N	Y	Y
Insulating dielectric layer
Glass glaze layer
Resistive layer

Thick-film resistor accuracy:

Print burn-in accuracy: typically ±20%, up to ±10%

Laser trimming accuracy: up to ±0.1%, tracking accuracy 0.05%

Laser functional ablation:

Apply input to the circuit, monitor the output, eliminate component variability, and ensure high precision and consistency in product performance metrics.

Serial number	Feature	Minimum value	Normal value	Maximum value	Note
	Substrate size		50.8~101.6	152.4
B	Substrate thickness	Any thickness between 0.254 and 1.016; common thicknesses are 0.381, 0.635, 0.762, and 1.016.
	Trace width	0.15	≥0.2
D	Conductor spacing	015	≥0.2
	Metallized hole diameter	0.18	0.20~0.30	0.5
	Hole spacing and distance from hole to edge of frame	≥1.2 times the substrate thickness, and not less than 1.0
	Resistance length	0.3	≥0.50		1)

Unit: mm

1) Resistance aspect ratio G/H: Typical values range from 0.50 ≤ G/H ≤ 5, with a maximum of 0.30 ≤ G/H ≤ 10. The resistance area and the aspect ratio G/H are primarily determined by tolerance, power rating, and resistance‑value requirements and constraints.