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BaiseLow-Temperature Co-fired Ceramic (LTCC)

LTCC technology involves grinding low‑temperature sintering ceramic powders and forming them into precisely controlled‑thickness, highly dense green ceramic tapes. Circuit patterns are then fabricated on these tapes using processes such as mechanical punching, laser drilling, via filling, and precision conductor‑paste printing. Multiple passive components—such as low‑value capacitors, resistors, and couplers—are embedded within the multilayer ceramic green tapes, which are subsequently stacked, sintered at 850°C, and diced to produce three‑dimensional, interference‑free, high‑density circuits. Finally, various packaged ICs, bare chips, and active devices are mounted on the surface, yielding integrated passive‑active functional modules that further enable circuit miniaturization and higher density, making LTCC particularly well suited for high‑frequency communication components, high‑frequency filters, and microwave antennas.

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Product Description

LTCC technology involves grinding low‑temperature sintering ceramic powders and then forming them into green ceramic tapes of precise thickness and high density. Circuit patterns are fabricated on these green tapes using processes such as mechanical punching, laser drilling, via filling, and precision conductor‑paste printing. Multiple passive components—such as low‑value capacitors, resistors, and couplers—are embedded within the multilayer ceramic green tapes, which are subsequently stacked, sintered at 850°C, and diced to produce three‑dimensional, non‑interfering, high‑density circuits. Various packaged ICs, bare chips, and active devices are then mounted on the surface, yielding integrated passive‑active functional modules that further enable circuit miniaturization and higher density. This technology is particularly well suited for high‑frequency communication components, high‑frequency filters, and microwave antennas.

Product Features:

Higher integration, excellent high-frequency performance, thermal stability, high reliability, and the ability to integrate passive components internally, among other features.

Technical Process:

Substrate material	Ferro A6M green ceramic tape
Conductive paste	Ferro All-Metal Series, All-Silver Hybrid Series
Resistor paste	Ferro FX87 Series

Main Performance Table of Green Ceramic Tape Material:

LTCC type

Sintering layer thickness

(mm)

Shrinkage rate

X- Y,%

Shrinkage rate

(Z,%)

Dielectric

Constant

Insulation resistance

(Q)

Breakdown voltage

(V/floor)

Sintered density

(g/m ³⁾

Coefficient of thermal expansion

(ppm/°C

Tangent loss

Flexural strength

(Pa)

Thermal conductivity

(w/m.k)

Curve curvature

FerroA6M

0.095

15.2

5.9

>1012

5000

2.45

0.20%

170MPa

0.30%

Design Specifications

Co-firing materials	All-metal system
	Hybrid system	Outer layer: Pd/Ag or gold conductor; inner layer: Ag conductor.
Post-burn material	Printed on the sintered TCC substrate, typically in the form of (Pd/Ag).
LTCC thickness	Minimum: 0.5 mm (5 layers), Maximum: 3 mm (30 layers)
LTCC green ceramic sheet dimensions	Typically, the maximum dimensions are 203.20 × 203.20 × 0.127 mm, and it can be cut to size.
Dimensional tolerance	The typical dimensional tolerance after cutting is ±0.10 mm.

Wiring Design Guidelines

Feature		Standard	smallest
A	Line width	0.2	0.1
B	Line spacing	0.2	0.1
C	Wire hole spacing	0.2	0.1
D	Distance from the trace to the edge of the PCB	0.3	0.2
E	Distance from the weld zone to the via coverage area	0.2	0.1
F	Distance from the weld zone to the conduction band	0.2	0.1
	Through-hole size	Typically 0.15, 0.20, or 0.30.
	Minimum via spacing on the same layer	2.5x0, or 0.5
	Minimum via spacing between adjacent layers	2.0x0
	Distance from hole to edge	Minimum is 3x0, or hole-to-edge clearance of 0.38.