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SipingOne-stop service for domestically produced circuit boards
Product Description
Board customization
Our company boasts a mature, end-to-end system covering board‑level design, component procurement, manufacturing, and quality inspection. In particular, for component sourcing, we leverage the parent company’s ecosystem—comprising Weike Electronics, Hunan Jiuqiang, Changsha Shaoguang, Wuhan Navigation Institute, CETC Huaxing, Honglin Microelectronics, and other enterprises—enabling us to offer unique supply‑chain channels and cost advantages, as well as customized board‑level solutions across a wide range of products.
| Board design capability | Board customization |
| Maximum number of PCB layers: 42 | SI/PI co-simulation, batch simulation |
| Maximum number of PINs: 100,000+ | DDR3/DDR4 emulation |
| Maximum connections: 75,000+ | PCIe, SATA, SAS, SFP, XFP, SRIO, etc. |
| Minimum trace width: 2.4 mil | High-Speed Serial Signal Simulation |
| Minimum trace spacing: 2.4 mil | |
| Minimum via size: 6 mil (4 mil laser-drilled) | |
| Maximum number of BGAs: 100+ |
PCB SMT Assembly Capability
|
Mounting speed |
CPH: 90,000 × 2 (units)/item (SMT line) |
|
Maximum sheet size |
460mm*340mm |
|
Minimum sheet size |
50mm*50mm |
|
Board thickness |
0.3mm~5mm |
|
Minimum device accuracy |
±0.04mm (CPK≥1.0 @ ±40μm) |
|
IC-type chip mounting accuracy |
±0.03mm (CPK≥1.0 @ ±30μm) |
|
Minimum mounting component |
0201 (0.6 mm × 0.3 mm) |
|
SPI resolution |
13 μm |
|
AOI resolution |
15 μm |
|
X-ray resolution |
2 μm |
|
Reflow Oven Temperature Control Zone |
10 temperature zones on both the top and bottom |
|
Reflow oven temperature control accuracy |
±2℃ |
Next item
Room 1907, Building 4, Chongwen Garden, No. 1 Tangling Road, Fuguang Community, Taoyuan Subdistrict, Nanshan District, Shenzhen
0755-26692710