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A thick‑film hybrid integrated circuit is a miniature electronic functional component that uses a ceramic substrate as its base. It employs various conductor pastes—such as palladium–silver, platinum–silver, and gold conductive pastes—as well as resistor paste for resistors—and applies thick‑film processes—including screen printing, 850°C high‑temperature sintering, and laser trimming of resistors—to fabricate passive networks on a single substrate. Discrete semiconductor device chips, monolithic integrated circuits, or microcomponents are then mounted on this substrate, followed by external packaging to form the complete hybrid integrated circuit.
LTCC technology involves grinding low‑temperature sintering ceramic powders and forming them into precisely controlled‑thickness, highly dense green ceramic tapes. Circuit patterns are then fabricated on these tapes using processes such as mechanical punching, laser drilling, via filling, and precision conductor‑paste printing. Multiple passive components—such as low‑value capacitors, resistors, and couplers—are embedded within the multilayer ceramic green tapes, which are subsequently stacked, sintered at 850°C, and diced to produce three‑dimensional, interference‑free, high‑density circuits. Finally, various packaged ICs, bare chips, and active devices are mounted on the surface, yielding integrated passive‑active functional modules that further enable circuit miniaturization and higher density, making LTCC particularly well suited for high‑frequency communication components, high‑frequency filters, and microwave antennas.
Equipment: Hydrogen removal furnace / Eutectic sintering furnace / Automatic dispensing and placement machine / Plasma cleaner / Fully automatic gold wire ball bonding machine / Multi‑function wedge bonding machine / Parallel seam welder
Our company boasts a mature and comprehensive system covering board‑level design, component procurement, manufacturing, and quality inspection. In particular, with respect to component sourcing, leveraging the parent company’s network—including Weike Electronics, Hunan Jiuqiang, Changsha Shaoguang, Wuhan Navigation Institute, CETC Huaxing, Honglin Microelectronics, and other enterprises—we benefit from unique supply‑chain channels and cost advantages, enabling us to offer customized solutions for a wide range of circuit boards.
Room 1907, Building 4, Chongwen Garden, No. 1 Tangling Road, Fuguang Community, Taoyuan Subdistrict, Nanshan District, Shenzhen
0755-26692710