products
Thick-film circuit
The products are applied in fields such as the defense industry, telecommunications, automotive electronics, medical electronics, industrial control, signal processing, high‑voltage surge suppression for power modules, and variable‑speed motor control.
Category:
Product Details
A thick-film hybrid integrated circuit is a miniature electronic functional component that uses a ceramic substrate as its base. It employs various conductor pastes—such as palladium–silver, platinum–silver, and gold—as well as resistor pastes, and utilizes thick-film processes—including screen printing, 850°C high-temperature sintering, and laser trimming of resistors—to fabricate passive networks on a single substrate. Discrete semiconductor device chips, monolithic integrated circuits, or micro‑components are then mounted on this substrate, followed by external packaging to form the complete hybrid integrated circuit.
Product Features:
High reliability, high stability, high integration, and low cost
Technical Process:
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Substrate material |
96 porcelain, 99 porcelain, aluminum nitride, printed circuit boards, etc. |
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Conductive paste |
Palladium-silver, platinum-silver, gold, etc. |
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Resistor paste |
DuPont 17 series, Heraeus R89 series, Xi’an Hongxing R-8200 series resistor pastes, and others. |
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Assembly |
SMT, gold wire/aluminum wire bonding, soldering, conductive adhesive bonding, eutectic bonding, and others |
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Encapsulation |
Epoxy coating, parallel seal welding |
Thick-Film Circuit Material Systems and Conductor Connection Characteristics:
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Membrane layer |
Gold wire bonding |
Aluminum wire bonding |
Eutectic bonding |
Soldering |
Epoxy bonding |
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Conductive layer |
Gold |
Y |
N |
Y |
N |
Y |
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Pd /Ag |
N |
Y |
N |
Y |
Y |
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Pt/Ag |
N |
Y |
N |
Y |
Y |
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Insulating dielectric layer |
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Glass glaze layer |
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Resistive layer |
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Thick-film resistor accuracy:
Print burn-in accuracy: typically ±20%, up to ±10%
Laser trimming accuracy: up to ±0.1%, tracking accuracy 0.05%
Laser functional ablation:
Apply input to the circuit, monitor the output, eliminate component variability, and ensure high precision and consistency in product performance metrics.
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Serial number |
Feature |
Minimum value |
Normal value |
Maximum value |
Note |
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Substrate size |
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50.8~101.6 |
152.4 |
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B |
Substrate thickness |
Any thickness between 0.254 and 1.016; common thicknesses are 0.381, 0.635, 0.762, and 1.016. |
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Trace width |
0.15 |
≥0.2 |
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D |
Conductor spacing |
015 |
≥0.2 |
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Metallized hole diameter |
0.18 |
0.20~0.30 |
0.5 |
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Hole spacing and distance from hole to edge of frame |
≥1.2 times the substrate thickness, and not less than 1.0 |
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Resistance length |
0.3 |
≥0.50 |
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1) |
Unit: mm
1) Resistance aspect ratio G/H: Typical values range from 0.50 ≤ G/H ≤ 5, with a maximum of 0.30 ≤ G/H ≤ 10. The resistance area and the aspect ratio G/H are primarily determined by tolerance, power rating, and resistance‑value requirements and constraints.
Keywords: Hybrid Integrated Circuit
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