Products
Thick film circuit
Products involved in the defense industry, communications, automotive electronics, medical electronics, industrial control, signal processing, power module high-voltage surge suppression, variable speed motor control and other fields.
Classification:
Product Details
Thick film hybrid integrated circuit is a kind of miniature electronic functional components, it is the use of ceramic substrate as the substrate, with all kinds of palladium silver conductor paste, platinum silver conductor paste, gold conductor paste and nail series resistor paste, etc., using screen printing, 850 degree high temperature sintering and laser trimming resistor and other thick film process on the same substrate to make passive network, and on the assembly of discrete semiconductor device chips, monolithic integrated circuits or microcomponents, and then packaged into a hybrid integrated circuit.
Product features:
High reliability, high stability, high integration, low cost
Technical process:
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Substrate material |
96 porcelain, 99 porcelain, aluminum nitride, printed circuit board, etc. |
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conductor paste |
Palladium silver, platinum silver, gold, etc |
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resistance paste |
DuPont 17 series, Heli R89 series, Xi'an Hongxing R-8200 series resistance paste, etc. |
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Assembly |
SMT, gold/aluminum wire bonding, solder welding, conductive adhesive bonding, eutectic bonding, etc. |
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Encapsulation |
Epoxy coating, parallel sealing welding |
Thick film circuit material system and conductor connection characteristics:
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Film layer |
gold wire bonding |
aluminum wire bonding |
eutectic bonding |
Soldering |
epoxy bonding |
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conductor layer |
Gold |
Y |
N |
Y |
N |
Y |
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Pd /Ag |
N |
Y |
N |
Y |
Y |
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Pt/Ag |
N |
Y |
N |
Y |
Y |
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insulating dielectric layer |
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glass glaze layer |
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resistance layer |
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thick film resistor precision:
Printing accuracy: normal ± 20%, maximum ± 10%
Laser trimming accuracy: maximum ± 0.1%, tracking accuracy 0.05%
Laser function repair resistance:
Add input to the circuit, monitor the output, eliminate the discrete type of components, and ensure the high precision and consistency of the product output index
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Serial Number |
Features |
Minimum |
regular value |
Maximum |
Remarks |
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Substrate size |
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50.8~101.6 |
152.4 |
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B |
substrate thickness |
Any thickness between 0.254~1.016, commonly used 0.381, 0.635, 0.762, 1.016 |
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Wire width |
0.15 |
≥ 0.2 |
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D |
Wire distance |
015 |
≥ 0.2 |
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metalized aperture |
0.18 |
0.20~0.30 |
0.5 |
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Hole Distance and Distance from Hole to Border |
≥ 1.2 times substrate thickness, and not less than 1.0 |
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resistance length |
0.3 |
≥ 0.50 |
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1) |
Unit: mm
1) Resistor aspect ratio G/H: regular value 0.50 ≤G/H≤ 5, maximum value 0.30 ≤G/H≤ 10 Resistor area and aspect ratio G/H depend more on the requirements and limitations of tolerance, power and resistance
Key Words: Hybrid integrated circuit
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