Products
SIP micro-assembly
Products involved in the defense industry, communications, automotive electronics, medical electronics, industrial control, signal processing, power module high-voltage surge suppression, variable speed motor control and other fields.
Classification:
Product Details
SIP assembly capability
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Equipment |
Characteristics |
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hydrogen removal furnace |
① Working temperature 200~600 ℃; ② Temperature uniformity ± 5 ℃; |
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eutectic sintering furnace |
① The maximum working temperature is 450 ℃; ② Temperature uniformity ± 5 ℃; ③ Temperature control accuracy ± 1 ℃; ④ Limit vacuum degree 5Pa; ⑤ Process gas: nitrogen or formic acid. |
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Automatic Dispensing Machine |
① Chip size 0.3~25(mm); ② Repeated positioning accuracy in XY direction: ≤ ± 0.001mm @ 3o; ③ Angle control accuracy: ≤ ± 0.5 °; ④ Mount and lift control: ≤ 0.5 °; ⑤ Comprehensive pick-and-place accuracy: ≤ ± 0.015mm @ 3o(CPH standard mode). |
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plasma cleaning |
① Output effective power: 0-600W; ② discharge vacuum: 20-50Pa. |
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Automatic gold wire ball bonding machine |
① Welding positioning accuracy: ≤ ± 3μ @ 3o; ② Applicable wire diameter: 15-50μ; ③ Minimum welding spot diameter: ≥ 65μ (based on 25μ wire diameter); ④ Minimum lead wire arc height: ≤ 65μ (based on 25μ wire diameter). |
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Multifunctional Wedge Welding Bonding Machine |
① Wire diameter: aluminum wire (18~100 μm), gold wire (15~75 μm), gold strip (12.7x 50 μm ~ 25.4x 300 μm), specific alloy wire; ② Cavity depth range: maximum 21mm; ③ Z stroke of bonding head: 19mm; ④ X-Y range of bonding head: 15mm in X direction and 15mm in Y direction. |
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parallel seam welding machine |
① Applicable to the shell size:(4~200)×(4~200)(mm); Adapt to the shell shape: rectangular, circular; ③ applicable cover plate thickness:(0.1~0.15)mm. |
Key Words: Hybrid integrated circuit
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