products
SIP Micro-Assembly
The products are applied in fields such as the defense industry, telecommunications, automotive electronics, medical electronics, industrial control, signal processing, high‑voltage surge suppression for power modules, and variable‑speed motor control.
Category:
Product Details
SIP assembly capability
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Equipment |
Characteristics |
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Hydrogen removal furnace |
① Operating temperature: 200–600°C; ② Temperature uniformity: ±5℃; |
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Eutectic Sintering Furnace |
① Maximum operating temperature: 450°C; ② Temperature uniformity: ±5℃; ③ Temperature control accuracy: ±1℃; ④ Ultimate vacuum level: 5 Pa; ⑤ Process gas: nitrogen or formic acid. |
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Automatic dispensing pick-and-place machine |
① Chip size: 0.3–25 mm; ②Repeatability in the X and Y directions: ≤±0.001 mm @ 3°; ③ Angular control accuracy: ≤±0.5°; ④ Mounting warpage control: ≤0.5°; ⑤ Overall pick-and-place accuracy: ≤±0.015 mm @ 30 CPH (standard mode). |
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Plasma cleaning |
① Output power: 0–600 W; ② Discharge vacuum level: 20–50 Pa. |
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Fully automatic gold wire ball bonding machine |
① Welding positioning accuracy: ≤±3 μm @ 3°; ② Applicable wire diameter: 15–50 μm; ③ Minimum solder joint diameter: ≥65 μm (based on a 25-μm wire diameter); ④ Minimum lead arc height: ≤65 μm (based on a 25-μm wire diameter). |
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Multi-functional wedge wire bonding machine |
① Bond wire diameters: aluminum wires (18–100 μm), gold wires (15–75 μm), gold ribbons (12.7 × 50 μm to 25.4 × 300 μm), and wires made of specific alloys; ② Cavity depth range: maximum 21 mm; ③ Bonding head Z travel: 19 mm; ④ Bonding head X–Y travel range: 15 mm in the X direction, 15 mm in the Y direction. |
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Parallel seam welder |
① Compatible with tube-and-shell dimensions: (4–200) × (4–200) mm; ② Adaptable to tube-and-shell shapes: rectangular, circular; ③ Adapted cover plate thickness: (0.1–0.15) mm. |
Keywords: Hybrid Integrated Circuit
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Room 1907, Building 4, Chongwen Garden, No. 1 Tangling Road, Fuguang Community, Taoyuan Subdistrict, Nanshan District, Shenzhen
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